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Kilopass' Gusto (TM) Ultra-Low Power NVM IP for Code Storage Enabled on UMC 55nm LP Process
HSINCHU, May 13, 2014 /PRNewswire/ -- Kilopass Technology Inc., a leading provider of semiconductor logic non-volatile memory (NVM) intellectual property (IP), and United Microelectronics Corporation (UMC) (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, today announced the availability of Kilopass' Gusto low power NVM IP on UMC's 55nm LP process following successful completion of 1,000 hours of JEDEC standard reliability testing. Gusto provides UMC customers designing system-on-chip (SoC) devices for high-volume portable and wireless products a highly secure, field programmable, high capacity memory for code storage. The Kilopass standard logic CMOS memory is ideal for storing boot code and encryption keys that can be erased and reprogrammed in the field.
"We are thrilled to have successfully enabled our Gusto NVM IP on UMC's 55nm LP process," says Linh Hong, vice president of Marketing and Business Development at Kilopass. "The 55nm node, a mature, cost effective, and highly available process is experiencing strong demand thanks to wireless and portable designs integrating more on board to reduce cost. Already, China will likely see a $25 smartphone sometime this year and Kilopass memory is the ideal storage for containing boot code and encryption keys that need to be secure and tamper proof."
Common hardware platforms developed for multiple applications are more widespread today given differentiation is created in software. Given this trend, Gusto is the ideal memory for code storage with low active power typically at 2.6mW, low standby power typically less than 3 uW, small footprint at less than 0.7mm^2/Mb, and high security to protect software IP. With programmability at wafer sort, final test, or in-system, it provides the ultimate flexibility for code.
Shih Chin Lin, senior division director of IP Development & Design Support division at UMC said, "UMC has a broad, robust ecosystem partnership with IP suppliers that allows customers to gain access to third party IP verified on UMC processes with minimal effort, investment, and lead time. Kilopass' Gusto adds another high-value IP block to our comprehensive IP portfolio, and is a welcome resource for our highly popular 55nm process technology. We look forward to further working with Kilopass on their IP solutions for UMC processes."
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC's robust foundry solutions allow chip designers to leverage the company's leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction has been completed for Phases 5&6, with future plans for Phases 7&8. The company employs over 15,000 people worldwide and has offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.
Kilopass Technology, Inc., a leading supplier of embedded NVM intellectual property, leverages standard logic CMOS processes to deliver one-time programmable (OTP) and many-time programmable (MTP) memory. With 60 patents granted or pending and more than 800,000 wafers shipped from a dozen foundries and Integrated Device Manufacturers (IDMs), Kilopass has more than 150 customers in applications ranging from storage of firmware and security codes to calibration data and other application-critical information. The company is headquartered in Santa Clara, Calif. For more information, visit www.kilopass.com or email firstname.lastname@example.org.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships, and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information concerning these risks is included in UMC's filings with the U.S. SEC, including on Form F-1, F-3, F-6 and 20-F, each as amended.
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